X-ray / CT system

Nikon

	XT V 130C
Max Kv	130kv
Max. electron beam power	10W
Focal spot size	3um
Feature recognition	2um
Imaging system (Standard)	1.45Mpixel 12bit camera with 6" image i ntensifier
Imaging system (Option)	1.45Mpixel 12bit camera with dual field 4"/6" image intensifier (XT V 130C) Varian 1313 or 2520 digital flat panel (14bit)
Manipulator	4-axis (X, Y, Z, T)
Rotate axis	Optional
Tilt	0 - 75 degrees
Measuring volume	Largest spuare in single map 406x406mm (16x16") Absolute max 711x762mm (28x30)
Max. sample weight	5kkg (11lbs)
Monitors	Dual 22 flat screen 1920x1080 pixels (standard) Single 30 flat screen 2560x1600 pixels (optional)
Cabinet dimensions (W x D x H)	1,200 x 1,786 x 1,916 (48.0 x 71.3 x 75.4")
Weight	1,935kg (4,266 lbs)
Radiation safety	<1uSv/hr at the cabinet surface
Control	Inspect-X control and analysis software
Automated inspection	Optional
Computed Tomography	Optional
Primary applications	Real-time electronics inspection

	XT V 160
Max Kv	160kv
Max. electron beam power	20W
X-ray source	Open tube transmission target
Focal spot size	1um
Feature recognition	500nm
Geometric magnification	2.5x-2,400x
System macnification	Up to 36,000x
Imaging system (Standard)	1.45Mpixel 12bit camera with dual field 4"/6" image intensifier
Imaging system (Option)	1.45Mpixel 12bit camera with dual field 4"/6" image intensifier (XT V 130C) Varian 1313 or 2520 digital flat panel (14bit)
Manipulator	5-axis (X, Y, Z, T, R)
Rotate axis	Included
Tilt	0 - 75 degrees
Measuring volume	Largest spuare in single map 406x406mm (16x16") Absolute max 711x762mm (28x30)
Max. sample weight	5kkg (11lbs)
Monitors	Dual 22 flat screen 1920x1080 pixels (standard) Single 30 flat screen 2560x1600 pixels (optional)
Cabinet dimensions (W x D x H)	1,200 x 1,786 x 1,916 (48.0 x 71.3 x 75.4")
Weight	1,935kg (4,266 lbs)
Radiation safety	<1uSv/hr at the cabinet surface
Control	Inspect-X control and analysis software
Automated inspection	Included
Computed Tomography	Optional
Primary applications	Real-time and automated electronics and semiconductor inspection

XT H 225 ST 는 다양한 범위의 재질과 샘플 사이즈에 이상적으로 적합한 CT 시스템 입니다. 특히 같은 범위의 다른 시스템에 있어 너무 크거나 무거운 것들 말입니다. 이 시스템에는 세 가지 상호 교환 가능한 소스가 잇습니다. 225kv 반사 타겟, 180kv 전송 타겟 그리고 선택적 225kv 회전 타겟. 선택가능한 다양한 범위의 납작한 패널 감지와 결합되어 ST 시스템은 품질 실험실, 생산 시설 및 연구 부서를 위한 유연한 도구를 제공합니다.

Microfocus source	Max. kV	Max. power	Focal spot size	Focal spot size at max power
180 kV Transmission target ○	180 kV	20 W	1 µm up to 3 W	20 µm at 20 W
225 kV Reflection target ●	225 kV	225 W	3 µm up to 7 W	225 µm at 225 W
225 kV Rotating target option ○	225 kV	450 W	10 µm up to 30 W	160 µm at 450 W

Detectors	# Bits	Active pixels	Pixel Size	Max. frame rate at 1x1 binning	Max. frame rate at 2x2 binning
Varex 4343 ○	16-bit	2880 x 2880	150 µm	15 fps	30 fps
Perkin Elmer 1611 ○	16-bit	4000 x 4000	100 µm	3.75 fps	7.5 fps
Perkin Elmer 1620 ○	16-bit	2000 x 2000	200 µm	3.75 fps	7.5 fps
Perking Elmer 1621	16-bit	2000 x 2000	200 µm	15 fps	30 fps
EHS ○

Manipulator
# Axes	5
Axes travel (Typical values - Exact values depend on system configuration)	(X) 450 mm (Y) 350 mm (Z) 725 mm (Tilt) +/- 30 (Rotate) n*360°
Max. sample weight	50 kg

General
Cabinet dimensions (LxWxH)	2,414 mm x 1,275 mm x 2,202 mm
Weight	4,200 kg
Safety	All systems are manufactured to IRR99
Control software	All systems are controlled by Nikon Metrology’s in-house Inspect-X software